WELLMAN Microfocus X-Ray Inspection System X6000
Industrial SMT PCB defect detection system that enables automated batch inspection, featuring high-precision imaging to detect BGA solder voids and PCB through-holes
Key Advantages
- 420×420mm work table that supports a 15KG load capacity
- Optional 360° rotary jig to enable multi-angle product inspection
- Intuitive operation, requiring only 2 hours of training for proficiency
- 3-axis linkage system with adjustable movement speed
- New-generation 5-inch high-definition digital flat panel detector (FPD)
- Enclosed X-ray tube with over 10,000 hours of operational life and maintenance-free performance
- Auto-navigation window – the worktable moves to the position you click
- Programmable inspection processes to enable automated batch inspection
Technical Specifications
X-ray Source
| Type | Closed, microfocus |
| Max tube voltage | 90kV |
| Max tube current | 200μA |
| Focal spot size | 5μm |
| Function | Auto preheat |
Flat Panel Detector
| Effective area | 130mm*130mm |
| Pixel size | 85μm |
| Resolution | 1536*1536 |
| Frame rate | 20fps |
Work Table
| Size | 420mm*420mm |
| Detectable area | 400mm*400mm |
| Max load | 15kg |
Equipment Parameters
| Magnification | Geometry 150X | System 1500X |
| Inspection speed | Max 3.0s/point |
| Dimensions | 1100mm (L) * 1000mm (W) * 1600mm (H) |
| Weight | 1000kg |
| Power supply | AC110-220V 50/60HZ |
| Max power | 1300W |
| Industrial PC | Intel I5 CPU, 8G RAM, 240GB SSD |
| Displayer | 24" HDMI LCD |
Safety Features
| Radiation leakage | No leakage (≤1μSv/h, international standard) |
| Lead glass observation window | Transparent lead glass shields radiation while allowing internal observation |
| Window/door safety interlock | X-ray automatically powers off when window/door is opened |
| Electromagnetic safety switch | Locks observation window when X-ray is active |
| Emergency stop | Instant power-off button near operation position |
| Tube protection | Software prevents X-ray tube from being left on |
Software Capabilities
Basic Operation
Full keyboard and mouse control for all functions, including X-ray tube activation and parameter adjustment.
Measurement Tools
Comprehensive measurement functions including distance, angle, radius, perimeter, and distance rate calculations for through-hole soldering analysis.
Automated Inspection
Three modes available: manual point setting, array pattern for regular points, and automatic feature recognition to enable efficient batch processing.
Image Processing
Adjustable brightness, contrast, and gain to achieve optimal image quality. Save and retrieve inspection parameters for repeated inspections.
Voids Rate Measurement
Automatically calculates solder ball voids rate area and circumference and identifies defects supports manual void marking and parameter saving for consistent results.
Working Principle
X6000 X-ray inspection system working principle
Application Examples
X6000 inspection application example 1
X6000 inspection application example 2
